Thursday 11th of March
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SEMICON China
10 Mar, 2010
World Gold Council, is helping to train engineers and chip designers in the technology of wire bonding. At next week’s SEMICON China 2010 we are sponsoring a seminar entitled ‘Materials Science of Wire Bonding & Wire Bond Reliability’ in conjunction with SEMI. This will include best practice in wire bonding technology and materials selection issues. [...]
Gold Innovations is the daily blog written by the Gold Bulletin team and other guest contributors. Read it here
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